First Level Inc. provides Electronic Manufacturing Services (EMS)to manufacturers for custom LED, MEMS and Optoelectronic products. We specialize in miniaturization of Microelectronic Packaging & precision placement assembly of surface mount components. Applications include: Electronic Sensors. Optoelectronics Devices, LED Arrays/LightEngines, Microwave, Medical Devices,Aerospace,Hybrid/Custom Modules, etc. Expertise in Flip Chip, Die Bonding, Wire Bonding/Stud Bumping techniques- ROHS Compliant
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