Ai Technology Inc

94
Ai Technology Inc
Ai Technology Inc is listed in the Computer Software & Services category in Princeton Junction, New Jersey. Displayed below are the social networks for Ai Technology Inc which include a Facebook page, a Google Plus page, a Linkedin company page and a Twitter account. The activity and popularity of Ai Technology Inc on these social networks gives it a ZapScore of 94.

Contact information for Ai Technology Inc is:
70 Washington Rd
Princeton Junction, NJ 08550
(609) 799-9388

"Ai Technology Inc" - ZapScore Report

94
Ai Technology Inc has an overall ZapScore of 94. This means that Ai Technology Inc has a higher ZapScore than 94% of all businesses on Zappenin. For reference, the median ZapScore for a business in Princeton Junction, New Jersey is 33 and in the Computer Software & Services category is 35. Learn more about ZapScore

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Ai Technology Inc Contact Information:

Social Posts for Ai Technology Inc


The latest Microchip, Microelectronic, IOT, LED, Moore, Semiconductor, DAF, Adhesives, Coatings, Substrates FYI! paper.li/aitechnologyin…


The latest Microchip, Microelectronic, IOT, LED, Moore, Semiconductor, DAF, Adhesives, Coatings, Substrates FYI! paper.li/aitechnologyin…


The latest Microchip, Microelectronic, IOT, LED, Moore, Semiconductor, DAF, Adhesives, Coatings, Substrates FYI! paper.li/aitechnologyin…


The latest Microchip, Microelectronic, IOT, LED, Moore, Semiconductor, DAF, Adhesives, Coatings, Substrates FYI! paper.li/aitechnologyin…


The latest Microchip, Microelectronic, IOT, LED, Moore, Semiconductor, DAF, Adhesives, Coatings, Substrates FYI! paper.li/aitechnologyin…


AIT’s newest thermal adhesive tape, COOL-BOND™ PSA-3NC, is a novel non curing pressure sensitive thermal adhesive tape. It utilizes super fine alumina crystallite filled pressure sensitive interface film that provides instant bonding and thermal transfer. It is designed for thermal transfer of memory, power devices, and modules to heat sinks and is thermally conductive yet electrically insulating. With COOL-BOND™, there is never a concern of shorting electrical components. COOL-BOND™ PSA-3NC is non curing, allowing for the easy removal of the heat sink for testing or upgrades.

AI Technology's COOL-SILVER Pad™ contains 92% silver by weight, 0% silicone, and is RoHS compliant. The thermal resistance is lower than the known industry standard of <0.00450C-in2/Watt @ 0.001 inch interface layer thickness. AIT’s COOL-SILVER Pad™, unlike some of the earlier generations of silver compounds, will not separate, run, migrate, or bleed. Even though the thermal conductivity comes from the highly packed micronized pure silver particulate, it is not electrically conductive. Side by side comparison with the best known thermal interface compounds for CPU applications demonstrated the superior performance of COOL-SILVER Pad™.

AIT’s latest thermal interface material, COOL-GREASE™ ZX, is a modified zinc oxide filled, electrically insulating, and thermally conductive grease which exhibits outstanding thermal transfer in comparison to all thermal greases that we have tested including silver and diamond based products. The non curing nature of COOL-GREASE™ ZX makes it ideal as an interfacial compound for thermal transfer between computer processors and heat sinks.